Sensor Packaging Protection
Precision encapsulation and potting for aerospace sensor packaging — protecting pressure, temperature, MEMS and optical sensors from vibration, altitude and thermal extremes.
Precision Protective Packaging for Flight-Critical Aerospace Sensors
Aerospace sensors — pressure transducers, temperature probes, MEMS accelerometers and gyroscopes, and optical sensing elements — provide the measurement data flight control, navigation and engine monitoring systems depend on, operating in locations exposed to extreme vibration, altitude-driven pressure and temperature cycling, and in some installations, direct exposure to fuel, hydraulic fluid or exhaust gas. Protective packaging must shield these sensing elements from their operating environment without introducing mechanical stress or thermal lag that would compromise the very measurement accuracy the sensor exists to provide.
The dispensing challenge is packaging-specific to each sensor type: MEMS accelerometers and gyroscopes require encapsulation that adds environmental protection without introducing stress that biases inertial measurement, pressure transducers require sealing that protects electronics while preserving an accurate reference to the measured pressure, and optical sensors require encapsulation that avoids any intrusion into the optical path. Across all these formats, cure temperature and dwell time must respect the sensor's calibration stability, since excess thermal exposure during packaging can shift a precision-calibrated sensor's output.
SANCO CCD vision-guided precision dispensing systems, built on our desktop visual dispensing machine platform, deliver the sensor-type-specific coverage precision and controlled cure process required across the range of aerospace sensor packaging protection applications.
Why Aerospace Sensor Packaging Requires Measurement-Preserving Protection
Protective packaging must shield sensing elements from extreme flight environments without introducing the stress or thermal lag that would compromise measurement accuracy.
Stress-Free Encapsulation for MEMS Inertial Sensors
MEMS accelerometers and gyroscopes are sensitive to mechanical stress introduced by encapsulation material cure shrinkage; packaging must add environmental protection without biasing the inertial measurement the sensor is designed to provide.
Pressure Reference Preservation for Pressure Transducers
Pressure sensor packaging must protect electronics while maintaining an accurate, unobstructed reference path to the measured pressure; encapsulant intrusion into this reference path directly corrupts the sensor reading.
Optical Path Protection for Optical Sensing Elements
Optical sensors require encapsulation that provides environmental protection around the sensing element while avoiding any intrusion into or contamination of the optical path itself.
Calibration Stability Through the Packaging Cure Process
Precision-calibrated sensors can experience measurable calibration shift if packaging cure temperature or dwell time exceeds the sensor's thermal tolerance; cure process parameters must respect this constraint.
Vibration and Shock Resistance
Sensors mounted on engines, landing gear or other high-vibration locations require packaging that maintains protective integrity and sensor mounting stability under sustained vibration and shock loading.
Fuel, Hydraulic Fluid and Exhaust Gas Resistance
Sensors installed near engines, fuel systems or hydraulic lines require encapsulant chemistry resistant to these aerospace-specific fluid and gas exposures without degradation over the sensor's service life.
Key Capabilities for Aerospace Sensor Packaging Protection
Low-Stress Encapsulation for Inertial Sensors
Precise volume control and low-shrinkage encapsulant compatibility minimise mechanical bias introduced into MEMS accelerometer and gyroscope sensing elements.
Pressure Reference Path-Safe Dispensing
Controlled dispensing path and volume preserve unobstructed pressure reference paths for pressure transducer packaging applications.
Optical Path Keep-Out Precision
CCD vision-guided dispensing precisely avoids optical sensing surfaces, maintaining a clear, uncontaminated optical path through the encapsulation process.
Calibration-Preserving Low-Temperature Cure
Cure temperature and dwell time parameters are tuned to stay within the thermal tolerance of precision-calibrated sensing elements.
Vibration & Shock-Resistant Formulation Support
Platform supports encapsulant chemistries engineered to maintain protective integrity and mounting stability under sustained flight vibration and shock loading.
Fuel & Hydraulic Fluid-Resistant Chemistry Compatible
Dispensing system handles encapsulant formulations resistant to fuel, hydraulic fluid and exhaust gas exposure for engine- and fuel-system-adjacent sensor installations.
Dam-and-Fill Boundary Control
Programmable containment dam dispensing defines precise encapsulation zone boundaries for targeted, rather than full-cavity, sensor protection.
Inline Aerospace Sensor Assembly Integration
SMEMA-compatible conveyor integration links SANCO encapsulation equipment directly into aerospace sensor assembly lines between component placement and functional/calibration test.
The Aerospace Sensor Packaging Protection Process Step by Step
Sensor packaging must combine environmental protection with preservation of measurement accuracy and calibration stability. SANCO equipment is calibrated for every stage.
Sensor Substrate Load & Vision Alignment
Sensor die or assembly is loaded and CCD vision locates component placement references and encapsulation boundaries.
Dam / Boundary Dispensing
A containment dam defines the protective fill boundary where targeted encapsulation is required.
Protective Encapsulant Dispensing
Encapsulant is deposited over the sensor element and connection points, avoiding active sensing surfaces.
Cure
Encapsulant cures at a temperature and duration compatible with the sensor's calibration stability.
Thermal Cycling & Functional Verification
Sample units undergo thermal cycling, vibration testing and functional verification to confirm protection without measurement compromise.
Aerospace Sensor Packaging Material Types & SANCO Compatibility
SANCO dispensing machines handle the encapsulant materials used across aerospace pressure, temperature, MEMS and optical sensor packaging protection.
| Material Type | Viscosity Range | Cure Method | Typical Application | SANCO Compatibility |
|---|---|---|---|---|
| Low-Stress Silicone Encapsulant | 5,000 – 30,000 mPa·s | Thermal 60–100°C | Stress-minimizing encapsulation for MEMS accelerometer and gyroscope packaging | Recommended |
| Optically Clear Encapsulant | 2,000 – 15,000 mPa·s | Thermal 60–80°C or UV | Protective, path-preserving encapsulation for optical sensing element packaging | Recommended |
| Fluorosilicone Chemical-Resistant Encapsulant | 8,000 – 40,000 mPa·s | Thermal 60–80°C | Fuel- and hydraulic-fluid-resistant packaging for engine- and fuel-system-adjacent sensors | Recommended |
| Vibration-Damping Silicone Gel | 5,000 – 25,000 mPa·s | Thermal 60–100°C | Shock- and vibration-absorbing encapsulation for sensors in high-vibration mounting locations | Recommended |
| Low-Temperature Cure Epoxy | 3,000 – 20,000 mPa·s | Thermal 40–60°C | Calibration-preserving encapsulation for precision-calibrated temperature and pressure sensors | Recommended |
Frequently Asked Questions
How does SANCO minimise stress on MEMS inertial sensors during encapsulation?
SANCO dispensing systems support low-shrinkage, low-stress silicone encapsulant formulations combined with precise volume control, minimising mechanical bias introduced into MEMS accelerometer and gyroscope sensing elements during the encapsulation and cure process. Contact our application engineers to review encapsulation parameters for your inertial sensor design.
Can SANCO equipment preserve pressure reference paths during transducer packaging?
Yes. Controlled dispensing path and precise volume control keep encapsulant away from the pressure reference path, preserving accurate, unobstructed pressure measurement while protecting the surrounding electronics.
How does SANCO avoid contaminating the optical path on optical sensor packages?
CCD vision-guided dispensing precisely identifies and avoids optical sensing surfaces, keeping encapsulant confined to the surrounding protective zone without intrusion into or contamination of the optical path.
Does SANCO support cure processes that preserve sensor calibration stability?
Yes. Cure temperature and dwell time parameters are configurable to stay within the thermal tolerance of precision-calibrated sensing elements, using low-temperature cure formulations where calibration sensitivity requires it.
Does SANCO support fuel- and hydraulic-fluid-resistant sensor packaging?
Yes. SANCO dispensing platforms handle fluorosilicone and other chemical-resistant encapsulant formulations suited to sensors installed near engines, fuel systems or hydraulic lines.
Where can I learn about other aerospace dispensing applications?
Visit our Applications section for guides covering potting for radar/navigation modules, connector sealing and potting and thermal interface material dispensing. For equipment specifications, see our dispensing machine product pages.
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